| 摘要 |
PROBLEM TO BE SOLVED: To improve buff processing efficiency of a substrate, in a buff processing apparatus using a buff pad having smaller dimensions than those of a substrate to be processed.SOLUTION: A buff processing apparatus performing buff processing of a processing object has a buff table for supporting a processing object, a buff pad configured to perform buff processing of a processing object by swinging on the processing object supported on the buff table in contact therewith, and a temperature controller for controlling the temperature of the processing object supported on the buff table. The area of the buff table for supporting the processing object is larger than the contact area of the buff pad with the processing object.SELECTED DRAWING: Figure 4 |
