DICING DIE BONDING FILM FOR SEMICONDUCTOR

摘要

The present invention relates to a dicing die bonding film for a semiconductor and, more specifically, to a dicing die bonding film for a semiconductor, which does not generate a peeling phenomenon between an adhesive layer and a release film for protecting an adhesive film during punching, and can easily exfoliate the adhesive layer and an adhesive film for protecting die bonding in a syndactyle process of a punched film having an excellent pickup property. According to the present invention, process stability and a process yield rate can be increased.