| 发明名称 |
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND CIRCUIT BOARD MANUFACTURING METHOD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide semiconductor devices and circuit boards with improved bonding accuracy in bonding processes of semiconductor devices via solder bumps. <P>SOLUTION: An embodiment comprises a solder bump 1 including: a barrier metal layer 2 formed on an electrode pad portion 9 of a substrate 5; and a solder layer 3 formed on a center part of the top face of the barrier metal layer 2, with an external diameter smaller than that of the barrier metal layer 2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2012204391(A) |
申请公布日期 |
2012.10.22 |
| 申请号 |
JP20110064837 |
申请日期 |
2011.03.23 |
| 申请人 |
SONY CORP |
发明人 |
SASAKI NAOTO;OZAKI YUJI |
| 分类号 |
H01L21/60;H01L25/065;H01L25/07;H01L25/18 |
主分类号 |
H01L21/60 |
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