| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device which can inhibit peeling of a semiconductor light-emitting element from a substrate even when repeatedly turning on and off the semiconductor light-emitting element, and to provide an illumination device. <P>SOLUTION: In the light-emitting device, a die-bonding material 39 of a light-emitting module 6 is provided so that the die-bonding material 39 has a Martens hardness of 800-1,000 N/mm2 after a light-emitting diode 37 has been mounted thereon, has a creep rate of 2-4% after a semiconductor light-emitting element has been mounted thereon, and has an elastic modulus of 15-20% after the semiconductor light-emitting element has been mounted thereon. <P>COPYRIGHT: (C)2013,JPO&INPIT |
