SEMICONDUCTOR DEVICE

摘要

Provided is a semiconductor device which is compact and highly reliable. The semiconductor device includes a multi-gauge strip leadframe having a thick portion and thin portions thinner than the thick portion, a chip mounting portion on which a semiconductor chip is mounted, a relaying portion connected via a lead wire to a connecting portion provided in the semiconductor chip, and connecting terminals connected to the relaying portion. In the multi-gage strip leadframe, the thick portion is formed at a center portion in a Y direction of this multi-gauge strip leadframe, with a predetermined width along an X direction perpendicular to the Y direction, and the thin portions are formed on opposed sides of the thick portion in the X direction. The chip mounting portion is formed in the thick portion and the relaying portion is formed in the thick portion separately from the chip mounting portion. The connecting terminals are formed in the thin portions.

主权项

1. A semiconductor device comprising:
a multi-gauge strip leadframe having a thick portion and thin portions thinner than the thick portion; a chip mounting portion on which a semiconductor chip is mounted; a relaying portion connected via a lead wire to a connecting portion provided in the semiconductor chip; and connecting terminals connected to the relaying portion; wherein in the multi-gage strip leadframe, the thick portion is formed at a center portion in a first direction of this multi-gauge strip leadframe, with a predetermined width along a second direction perpendicular to the first direction, and the thin portions are formed on opposed sides of the thick portion in the first direction; and wherein the chip mounting portion is formed in the thick portion and the relaying portion is formed in the thick portion separately from the chip mounting portion, and the connecting terminals are formed in the thin portions.