| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for a semiconductor IC, improving impedance mismatching at an end of an electrode pad, thereby achieving suppression of deterioration in propagation characteristics of an electrical signal.SOLUTION: The present invention provides a package for a semiconductor IC including an electrode pad on a surface of a side that is mounted on a mother board. The electrode pad includes a tapered part, the width of which gradually increases toward an end part. Disturbances of line impedance of an electrode pad can be improved by including a tapered part in the electrode pad, so that deterioration in propagation characteristics of an electrical signal due to impedance mismatching can be suppressed.SELECTED DRAWING: Figure 8 |
