发明名称 |
ANTI-CORROSION LEAD FRAME |
摘要 |
<p>A lead frame for a semiconductor chip package, including a die pad onto which a semiconductor chip will be attached; leads which will be electrically connected to the chip; and side rails supporting the leads and the die pad; a second metal being contact with the rails, this second metal having a higher standard electrode potential than that of the copper metal or alloy of which the remainder of the lead frame is made.</p> |
申请公布号 |
KR0152558(B1) |
申请公布日期 |
1998.10.01 |
申请号 |
KR19950035095 |
申请日期 |
1995.10.12 |
申请人 |
SAMSUNG ELECTRONICS CO.,LTD |
发明人 |
HWANG, KI-YEUN;KIM, HEE-SUK;LEE, JAE-WON |
分类号 |
H01L23/48;H01L23/495;H01L23/50;(IPC1-7):H01L23/50 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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