| 摘要 |
PROBLEM TO BE SOLVED: To eliminate a printing fault and to improve adhesiveness to a mater to be printed side when printed by removing a conductive layer opposed to each opening of a metal pattern layer and a resin film layer, and providing a penetrated pattern hole. SOLUTION: An ultrathin conductive layer 2 is formed on one surface of a resin film layer 1, a resist layer 3 is formed on the layer 2, and a resist pattern 4 having an opening 5 of a predetermined shape corresponding to a metal pattern layer is formed by a lithography method. An electrodeposited metal is formed by electrocasting on the layer 2 corresponding to the opening 5 of the pattern 4, and a metal pattern layer 6 is formed. Further, after the pattern 4 is removed, the layer 2 opposed to an opening 7 of the layer 6 and the layer 1 are irradiated with a laser beam from the side of the layer 6 and removed, thereby penetrating and forming a pattern hole 8.
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