| 摘要 |
<P>PROBLEM TO BE SOLVED: To stabilize a power supply voltage that is supplied to a controlled chip, relating to a stacked semiconductor device that uses a through electrode. <P>SOLUTION: The semiconductor device includes an interposer IP to which a substrate power supply terminal 91V is provided, an interface chip IF where a surface bump FB is provided on one surface, with a rear surface bump BB provided on the other surface, and a core chip CC connected to the interface chip IF. The positions in plan view, viewed along stacking direction of the surface bump FB and the rear surface bump BB, connected to the substrate power supply terminal 91V, being provided to the interface chip IF, as well as a through electrode TSV1 connecting them, agree among others, with an array pitch P2 of the rear surface bumps BB for signal being shorter than an array pitch P1 of them. Since a power supply can be supplied to the core chip from the interposer IP straight, a power supply voltage that is supplied to the core chip can be stabilized. <P>COPYRIGHT: (C)2013,JPO&INPIT |
