发明名称 MICROWAVE PLASMA PROCESSING DEVICE AND PLASMA PROCESSING GAS SUPPLY MEMBER
摘要 <p>A microwave plasma processing device and a gas supply member capable of forming a uniform thin film on a substrate to be processed. The microwave plasma processing device comprises a fixing means of fixing a substrate to be processed onto the center axis in a plasma processing chamber, an exhaust means of depressurizing the inside and outside of the substrate, a metal processing gas supply member present in the substrate and forming a reentrant cylindrical resonating system along with the plasma processing chamber, and a means of introducing a microwave into the plasma processing chamber to process it, wherein a microwave sealing member is provided in a specified position of the substrate-holding portion of the fixing means, and the connection position of the microwave introducing means is set to a specified weak-field position out of a field intensity distribution formed in the interior of the plasma processing chamber.</p>
申请公布号 WO2004081254(A1) 申请公布日期 2004.09.23
申请号 WO2004JP03202 申请日期 2004.03.11
申请人 TOYO SEIKAN KAISHA LTD.;KOBAYASHI, AKIRA;YAMADA, KOUJI;KURASHIMA, HIDEO;NAMIKI, TSUNEHISA;AIHARA, TAKESHI;ONOZAWA, YASUNORI 发明人 KOBAYASHI, AKIRA;YAMADA, KOUJI;KURASHIMA, HIDEO;NAMIKI, TSUNEHISA;AIHARA, TAKESHI;ONOZAWA, YASUNORI
分类号 B65D23/02;B65D25/14;C23C16/455;H01J37/32;H05H1/46;(IPC1-7):C23C16/511;B65D1/00 主分类号 B65D23/02
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