发明名称 METHOD FOR INJECTING IONS TO SEMICONDUCTOR SUBSTRATE TO PRECISELY CONTROL INJECTION OF IONS PARALLEL WITH SURFACE OF SEMICONDUCTOR SUBSTRATE
摘要 PURPOSE: A method for injecting ions to a semiconductor substrate is provided to precisely control the injection of ions parallel with the surface of a semiconductor substrate by applying an electric field to accelerate the ions in one direction and by applying a magnetic field in parallel with the surface crossing the one direction at a predetermined angle. CONSTITUTION: Ions are injected to the sidewall of a semiconductor layer(11) protruding to a semiconductor substrate(10). An electric field for accelerating the ions in one direction is applied and a magnetic field parallel with the surface crossing the one direction at a predetermined angle is applied, so that the direction of the ions injected to the sidewall of the semiconductor layer is controlled.
申请公布号 KR20050018607(A) 申请公布日期 2005.02.23
申请号 KR20040060760 申请日期 2004.08.02
申请人 SHARP CORPORATION 发明人 HORII, SHINJI;MASUOKA, FUJIO;TANIGAMI, TAKUJI;YOKOYAMA, TAKASHI
分类号 H01L21/265;H01L21/8247;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L21/265 主分类号 H01L21/265
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