发明名称 |
METHOD FOR INJECTING IONS TO SEMICONDUCTOR SUBSTRATE TO PRECISELY CONTROL INJECTION OF IONS PARALLEL WITH SURFACE OF SEMICONDUCTOR SUBSTRATE |
摘要 |
PURPOSE: A method for injecting ions to a semiconductor substrate is provided to precisely control the injection of ions parallel with the surface of a semiconductor substrate by applying an electric field to accelerate the ions in one direction and by applying a magnetic field in parallel with the surface crossing the one direction at a predetermined angle. CONSTITUTION: Ions are injected to the sidewall of a semiconductor layer(11) protruding to a semiconductor substrate(10). An electric field for accelerating the ions in one direction is applied and a magnetic field parallel with the surface crossing the one direction at a predetermined angle is applied, so that the direction of the ions injected to the sidewall of the semiconductor layer is controlled.
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申请公布号 |
KR20050018607(A) |
申请公布日期 |
2005.02.23 |
申请号 |
KR20040060760 |
申请日期 |
2004.08.02 |
申请人 |
SHARP CORPORATION |
发明人 |
HORII, SHINJI;MASUOKA, FUJIO;TANIGAMI, TAKUJI;YOKOYAMA, TAKASHI |
分类号 |
H01L21/265;H01L21/8247;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L21/265 |
主分类号 |
H01L21/265 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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