SEMICONDUCTOR CHIP WITH SOLDER BUMP SUPPRESSING GROWTH OF INTER-METALLIC COMPOUND AND METHOD OF FRABRICATING THE SAME

摘要

A semiconductor chip having a solder bump and a method of fabricating the same are provided. The semiconductor chip includes at least one metal adhesion layer formed on an electrode pad of the semiconductor chip, an interlayer isolation layer formed on the metal adhesion layer, at least one penetration layer formed on the interlayer isolation layer and penetrating into the solder bump, and the solder bump formed on the penetration layer. Thereby, materials of the penetration layer penetrate into the solder bump to change the solder bump into a multi-component solder bump, so that the growth of the IMC is suppressed, and the reliability of the semiconductor chip can be improved.