发明名称 |
Semiconductor device having RF shielding and method therefor |
摘要 |
A semiconductor device and method of manufacturing has a substrate having a plurality of metal layers. At least one metal layer is exposed on at least one side surface of the semiconductor device. A die is coupled to the substrate. A mold compound encapsulates the die and a top surface of the substrate. A conductive coating is applied to the mold compound and to at least one metal layer exposed on at least one side surface of the substrate.
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申请公布号 |
US8299610(B1) |
申请公布日期 |
2012.10.30 |
申请号 |
US20080971577 |
申请日期 |
2008.01.09 |
申请人 |
BERRY CHRISTOPHER J.;SCANLAN CHRISTOPHER M.;AMKOR TECHNOLOGY, INC. |
发明人 |
BERRY CHRISTOPHER J.;SCANLAN CHRISTOPHER M. |
分类号 |
H01L23/12 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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