| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photomask by which a thin film can be easily formed on an overlay vernier by forming an inclination on side portions of the overlay vernier, and to provide a method for forming an overlay vernier of a semiconductor device using the mask. <P>SOLUTION: The photomask includes a reticle 202 formed of a first material through which exposure light can transmit, a first pattern formed on the reticle and formed of a material through which light cannot transmit, a second pattern having a size smaller than the first pattern, and an auxiliary pattern 204 formed to come in contact with the first pattern and formed of a second material different from the first material of the reticle. <P>COPYRIGHT: (C)2009,JPO&INPIT |
