| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate treatment device having improved productivity by making characteristic values for the treatment results approximate target values, in all substrates to which etching treatment is applied after resist pattern forming treatment. <P>SOLUTION: The substrate treatment device includes inspecting means 301, 400 for measuring and inspecting the characteristic values for patterns formed on the substrates W after treated with resist pattern forming devices Li1-Li3 and etching pattern forming devices Et1-Et3, and a control means 600 for managing results for the substrates W measured by the inspecting means 301, 400 and managing carrying information for specifying modules Md and chambers Ch where the substrates W are treated. The control means 600 finds a range of correction values settable for the modules Md and the chambers Ch in accordance with the measurement results and the carrying information, and determines a combination of modules Md and chambers Ch so that the characteristic values for the patterns corrected in the range of the correction values approximate predetermined values for all substrates W. <P>COPYRIGHT: (C)2009,JPO&INPIT |
