| 摘要 |
An embodiment of the present invention relates to methods, device, and system for forming pitchers recessed with a high height to width ratio. Frequently, the pitchers are formed in context of manufacturing a vertical NAND (VNAND) memory device. Various embodiments disclosed in the present invention relate to process flows accompanying the steps of: depositing sacrificial posts on a metal seed layer covering a stack of materials laid below and molding the sacrificial posts; electroplating or electroless plating metal hard mask materials around the circumference of the sacrificial posts; removing the sacrificial posts; and etching the stack of materials laid below to form pitcher recessed with a high height to width ratio. |
