发明名称 METHOD FOR INSPECTING SUBSTRATE AND SUBSTRATE USING THE SAME
摘要 The present invention relates to a method for inspecting a substrate and the substrate using the same. The method comprises: a step of forming a substrate having an opened loop-type conductive pattern along with a peripheral part on a surface of a substrate body; a step of measuring a resistance value of the conductive pattern by contacting a resistance measuring means to opened both ends of the conductive pattern; and a step of determining whether the substrate is defective according to the size of the resistance value. According to the present invention, a user is able to clearly detect whether a substrate is cracked with a simple structure.
申请公布号 KR20160057676(A) 申请公布日期 2016.05.24
申请号 KR20140158569 申请日期 2014.11.14
申请人 SUNIC SYSTEM. LTD. 发明人 PARK, YOUNG SHIN;KIM, JUN SEUNG;JANG, SEUNG HUN
分类号 H01L21/66 主分类号 H01L21/66
代理机构 代理人
主权项
地址