发明名称 |
METHOD FOR INSPECTING SUBSTRATE AND SUBSTRATE USING THE SAME |
摘要 |
The present invention relates to a method for inspecting a substrate and the substrate using the same. The method comprises: a step of forming a substrate having an opened loop-type conductive pattern along with a peripheral part on a surface of a substrate body; a step of measuring a resistance value of the conductive pattern by contacting a resistance measuring means to opened both ends of the conductive pattern; and a step of determining whether the substrate is defective according to the size of the resistance value. According to the present invention, a user is able to clearly detect whether a substrate is cracked with a simple structure. |
申请公布号 |
KR20160057676(A) |
申请公布日期 |
2016.05.24 |
申请号 |
KR20140158569 |
申请日期 |
2014.11.14 |
申请人 |
SUNIC SYSTEM. LTD. |
发明人 |
PARK, YOUNG SHIN;KIM, JUN SEUNG;JANG, SEUNG HUN |
分类号 |
H01L21/66 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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