发明名称 |
CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE USING THE SAME |
摘要 |
According to one aspect of the present invention, there is provided a curable resin composition including at least: a polysiloxane compound having, in a molecule thereof, at least two functional groups selected from the group consisting of silanol groups and alkoxysilyl groups as a component (A-1); and silica whose extract water has a pH of 6.1 or lower at 25°C as a component (B), wherein the amount of the component (B) relative to the total amount of the components (A-1) and (B) is in a range of 70 to 97 mass%. This curable resin composition is able to, even when formed into various shapes and sizes, prevent foaming during curing and thus is suitable as an encapsulant material for a semiconductor element. |
申请公布号 |
EP3048133(A1) |
申请公布日期 |
2016.07.27 |
申请号 |
EP20160152642 |
申请日期 |
2016.01.25 |
申请人 |
CENTRAL GLASS COMPANY, LIMITED |
发明人 |
ODA, MASAFUMI;NAKATSUJI, JUNYA;SUGITA, YUTAKA;OGAWA, TSUYOSHI |
分类号 |
C08K3/36;C08G77/00;C08G77/04;C08L83/06;C09D183/04;H01L23/28;H01L23/29;H01L23/31;H01L23/495;H01L25/00 |
主分类号 |
C08K3/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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