| 摘要 |
Provided is a bonded compact which is a fired compact comprising a plate-like substrate having hole portions and a film bonded on each bonding surface of the substrate, charcterized in that a raion (T1/L1) of a thickness (T1) of a thinnest portion of the substrate to a maximum length (L1) in a cross-sectional shape of each of the hole portions in the substrate is 0.04 or more and 0.69 or less. Further provided is a method of producing "a ceramic green bonded compact in which a ceramic green film is bonded on each bonding surface of a ceramic green substrate having hole portions," the method imparting good adhesiveness to a thin green film while suppressing the green substrate from having deformation. In this method, first, a layer of a paste for bonding is formed on each bonding surface of green sheets prepared. Next, each bonding surface of the green sheets on which the paste layer is formed is brought into contact, in a state in which the paste layer is wet, with each bonding surface of a porous ceramic green substrate prepared. While this state is maintained, pores in the green substrate absorb a dispersion medium in the paste layer in the wet state. As a result, the paste layer is dried, thereby completely bonding the green substrate and the green sheets. |
