发明名称 |
EQUIPMENT FOR CLASSIFYING AND ACCEPTING A SEMICONDUCTOR PACKAGE |
摘要 |
PURPOSE: An equipment for classifying and accepting a semiconductor package is provided, which accepts a tray which a semiconductor package is accepted, withdraw a tray to be accepted among trays, and accepts a corresponding semiconductor package. CONSTITUTION: The equipment for classifying and accepting a semiconductor package comprises: a first lathe (10) which a tray for accepting a semiconductor package classified and dejected by a test equipment is temporarily fixed; a second lathe (20) which a laminate stocker, including a vertical plate to be vertically set up on a plane which is not identical to the first lathe (10), and a plurality of horizontal plate to be horizontally installed to the vertical plate; and a tray transmission means for arriving the tray to the horizontal plate, or transmitting the arrived tray to the first lathe (10). Thereby, it is possible to decrease the size of the equipment for classifying and accepting a semiconductor package.
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申请公布号 |
KR20000010422(A) |
申请公布日期 |
2000.02.15 |
申请号 |
KR19980031322 |
申请日期 |
1998.07.31 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
NA, YUN SEONG;KIM, HYUN HO;PARK, YOUNG GI |
分类号 |
H01L21/68;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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