APPARATUS AND METHOD FOR MEASURING THICKNESS OF SUBSTRATE CAPABLE OF RAPIDLY AND SIMPLY MEASURING THICKNESS OF SEMICONDUCTOR SUBSTRATE

摘要

PURPOSE: An apparatus and a method for measuring a thickness of a substrate are provided to rapidly and simply measure the thickness of the semiconductor substrate by using light reflected from a surface of the semiconductor substrate. CONSTITUTION: An apparatus for measuring a thickness of a substrate includes a sample stage which is vertically arranged. The sample stage(102) includes a first upper surface for supporting a reference sample(10) having a predetermined thickness. A substrate stage(104) has the same height as that of the first upper surface, and includes a second upper surface for supporting a substrate(20). An illumination unit(110) selectively radiates light on the reference sample(10) supported on the sample stage(102) and the substrate(20) supported on the substrate stage(104). A condenser lens has an optical axis extending in a vertical direction, and condenses a first light reflected from the reference sample(10) and a second light reflected from the substrate(20).