| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board capable of effectively preventing occurrence of static electricity during a step of peeling a release agent. SOLUTION: The method of manufacturing the printed wiring board by laminating a plurality of insulation substrates and conductor layers includes a step of peeling the release agent attached to front and rear faces of the conductor layer while soaking in a charge removal fluid. COPYRIGHT: (C)2007,JPO&INPIT
|
