发明名称 METHOD OF FORMING CIRCUIT PATTERN, CIRCUIT PATTERN FORMED BY USING SAME, AND LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide a method of forming a circuit pattern which manufactures a fine circuit pattern with few blots efficiently at low cost without short circuit, and to provide the circuit pattern formed by that, and, further, to provide a laminate having such a circuit pattern. SOLUTION: The method of forming the circuit pattern includes the steps of drawing fine lines of 3-row structure arranged at both sides in the widthwise direction of the surface and configured by a conductive paste which consists of metal nano particle conductivity paste and an insulator paste part made of insulator paste on a support or a substrate and an insulator paste part made of insulator paste, and baking processing to the support or the substrate in which the above fine line is drawn. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006269557(A) 申请公布日期 2006.10.05
申请号 JP20050082700 申请日期 2005.03.22
申请人 FUJI PHOTO FILM CO LTD 发明人 WAKI KOKICHI
分类号 H05K3/10;H05K3/12 主分类号 H05K3/10
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