| 摘要 |
PROBLEM TO BE SOLVED: To provide a shield structure which prevents the degradation of packaging quality due to increased size of a frame and enables a higher density device packaging while securing a required sufficient clearance region. SOLUTION: On a circuit wiring board 10 whereon a circuit device 5 which emits noise and a circuit device 6 which has to be protected against noise are mounted, a metal frame formed in the form of a frame is so arranged as to surround the circuit device 5. At the same time, another metal frame 3 is prepared which consists of three side faces with a side face opposite to the side face of the omitted metal frame 1. The metal frame 3 is so arranged as to surround the circuit device 6 as well as to be separated from the side face of the metal frame 1 by a predetermined clearance region. COPYRIGHT: (C)2007,JPO&INPIT
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