发明名称 PRINTED CIRCUIT BOARD HAVING BENDING PORTION AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a flexible printed circuit board which comprises a substrate film and a wiring pattern layer built in the surface of the substrate film, and which has a bending portion. SOLUTION: The printed circuit board has a bending portion which can be bent in the transverse direction. The bending portion is fabricated by forming an opening by selectively removing the substrate film from the printed circuit board, and then forming a top resin film and a bottom resin film so as to cover the top and bottom faces of the wiring pattern exposed in the opening by the top and bottom resin films, respectively. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008047674(A) 申请公布日期 2008.02.28
申请号 JP20060221296 申请日期 2006.08.14
申请人 THREE M INNOVATIVE PROPERTIES CO 发明人 OKURA HIROYUKI
分类号 H05K1/02;H05K3/00;H05K3/28 主分类号 H05K1/02
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