发明名称 |
Method for forming pattern, structural body, method for producing comb-shaped electrode, and secondary cell |
摘要 |
A method for forming a pattern multiple patterns of identical or different pattern materials can be formed on a support in a short time, a structural body, a method for producing a comb-shaped electrode, and a secondary cell. The pattern forming method, in which n patterns (n≧2) are formed on a support, includes forming a first resist layer on the support surface; repeating: forming a guide hole through all resist layers by exposure and development, filling a kth pattern material into the guide hole by a screen printing process, and forming a (k+1)th resist layer on the kth resist layer and the pattern materials, regarding kth (k=1 to n−1) pattern material and resist layer in order of k=1 to n−1; performing guide hole formation and nth pattern material filling similarly, and removing all of the resist layers. |
申请公布号 |
US9478791(B2) |
申请公布日期 |
2016.10.25 |
申请号 |
US201314426300 |
申请日期 |
2013.08.28 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
Ishikawa Kaoru;Asai Takahiro |
分类号 |
G03F7/00;H01M6/40;H01M4/04;H01M4/13;H01M4/70;H01M4/139;H01M10/058;G03F7/40;H01L21/288;H01M10/052;H01M10/0565;H01M4/02;H01L21/768;G03F7/12 |
主分类号 |
G03F7/00 |
代理机构 |
Knobbe Martens Olson & Bear LLP |
代理人 |
Knobbe Martens Olson & Bear LLP |
主权项 |
1. A method for forming a pattern, in which n patterns (n: an integer of at least 2) of identical or different pattern materials are formed on a support, the method comprising:
forming a first resist layer by coating a positive-type resist composition on a surface of the support, with respect to a kth pattern material and a kth resist layer in order of from k=1 to k=n−1 (k: an integer of 1 to n−1), repeating the steps of (i) to (iii):
(i) forming a guide hole through 1st to kth resist layers by exposure and development,(ii) filling a kth pattern material into the guide hole by a screen printing process, and(iii) forming a (k+1)th resist layer by coating a positive-type resist composition on the kth resist layer and the kth pattern material that has been filled into the guide hole, forming a guide hole through 1st to nth resist layers by exposure and development, completely filling a nth pattern material into the guide hole by a screen printing process, and removing the 1st to nth resist layers. |
地址 |
Kawasaki-Shi JP |