| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method of a wafer for preventing the grinding dust from sticking to a wafer, and for removing the grinding dust from the wafer, and to provide a processing device of a wafer.SOLUTION: The processing method of a wafer includes a cleaning step for cleaning the grinding dust formed in the grinding step by ejecting a mixed fluid composed of a gas and a liquid to the backside of a wafer, a drying step for drying the backside of a wafer by ejecting a gas thereto following to the cleaning step, and a dry processing step for removing the grinding dust produced on the wafer in the grinding step by performing dry processing on the backside of a wafer following to the drying step. |
