Power semiconductor device

摘要

The module (10) has an electrically insulating substrate arranged with a printed circuit board, which is spaced from the substrate by a housing. Strip conductors (22, 40) are contacted on an inner side (20) of the substrate facing the printed circuit board. Resilient connecting units are pressure contacted in the housing between strip conductors. Integrated circuit (IC) strip conductors (32) and a controlled IC component (24) are provided at the inner side of the substrate in addition to the strip conductors.