METHOD AND APPARATUS FOR POLISHING WAFER

摘要

PURPOSE: The method and apparatus is to uniformly polish all surfaces of the wafer and to make the space for placing the wafer and usage of expendable supplies minimum. CONSTITUTION: The apparatus comprises first rotating member to which workpiece to be machined is mounted and rotated, second rotating member, and abrasive supplying member which supplies abrasives to the second rotating member. In this method and apparatus, the distance between axis of rotation center of polishing table on which a polishing pad(25) that polishes wafer is arranged, and axis of rotation center of a polishing head(30) to which the wafer is mounted is set to be smaller than radius of the wafer. Also, to supply slurry as abrasive to surface of the wafer is made through the entire surface of the polishing table to the polishing pad. Thus, polishing operation is made more uniformly and precisely. and size of the apparatus becomes smaller generally.