| 摘要 |
PROBLEM TO BE SOLVED: To prevent peeling of a coverlay film from an end and entrapment of air bubbles as much as possible when stucking the coverlay film on a wiring pattern. SOLUTION: In the flexible printed wiring board 20, the surface of the wiring pattern 24 is protected by an insulting coverlay film 32 for protecting a pattern. In the board, the size of the coverlay film 32 is previously set so that a wiring pattern region L excluding the terminal 26 of the wiring pattern 24 may substantially match the shape of the coverlay film 32 in projection when stucking the coverlay film 32, thereby preventing the coverlay film 32 from being stuck on a portion where the wiring film 24 is not formed. COPYRIGHT: (C)2007,JPO&INPIT
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