COMPOSITION AND METHOD OF PREPARING ROOM TEMPERATURE RAPID CURABLE NON SLIP CONDUCTIVE ADHESIVES FOR PRE-TREATMENT OF SPOT WELD

摘要

A room temperature fast curing conductive adhesive composition for the pretreatment of spot welding, and a method for preparing a room temperature fast curing conductive adhesive by using the composition are provided to prevent slipping and to improve conductivity. A room temperature fast curing conductive adhesive composition comprises a uniform mixture; and 1-5 wt% of at least one powder selected from aluminum, copper and iron. The uniform mixture comprises 35-40 wt% of a polyol which comprises polyethylene glycol, polytetramethylene glycol or their mixture; 5-10 wt% of trimethylene propene; 2-5 wt% of tetraethylene diamine; 0.5-1 wt% of 2-ethyl-4-methylimidazole, 2,4,6-tris(dimethylaminomethyl)phenol or their mixture; and 40-45 wt% of toluene diisocyanate, diphenylmethane diisocyanate or their mixture.