Multi-Layer, Multi-Material Micro-Scale and Millimeter-Scale Devices with Enhanced Electrical and/or Mechanical Properties

摘要

Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.

主权项

1. A compliant probe for providing an electrical connection between at least two electronic components, the probe comprising:
a) a first planarized layer comprising at least a first structural material; b) a second planarized layer comprising at least a second structural material, wherein the second structural material is either directly adhered to the first layer or is separated from the first layer by one or more intermediate layers or one or more depositions of material; c) a third planarized layer comprising at least a third structural material, wherein the third structural material is either directly adhered to the second layer or is separated from the second layer by one or more additional intermediate layers or one or more depositions of material, wherein the second layer is located between the first and third layers, and wherein the second material is different from both the first material and the third material, and wherein upon use, the compliant probe is configured to provide an elastic electrical contact path between at least two electronic components.