Vertical spiral inductor

摘要

Methods and apparatuses, wherein the method forms a first plurality of vias in a substrate, further comprising forming the first plurality of vias to be substantially the same height. The method forms a plurality of conductive traces external to the substrate and couples the plurality of conductive traces to the first plurality of vias: wherein the plurality of conductive traces and the first plurality of vias comprise a plurality of conductive turns and wherein the plurality of conductive turns are in a spiral configuration substantially within a first plane.

主权项

1. An inductor, comprising:
a first plurality of vias through a substrate, wherein the first plurality of vias are substantially the same height; and a plurality of conductive traces external to the substrate interconnecting the first plurality of vias, wherein the plurality of conductive traces and the first plurality of vias comprise a plurality of conductive turns, wherein the plurality of conductive turns are in a spiral configuration substantially within a first plane, wherein the inductor further comprises a plurality of lead out patterns in a second plane perpendicular to the first plane, the plurality of lead out patterns comprising a first lead out and a second lead out, wherein the first lead out is coupled to a first via of the first plurality of vias, the first via adjacent to at least two other vias of the first plurality of vias, and wherein the second lead out is coupled to a second via of the first plurality of vias, the second via adjacent to one other via of the first plurality of vias.