| 摘要 |
PROBLEM TO BE SOLVED: To increase the measurement accuracy of a thermal flowmeter.SOLUTION: The thermal flowmeter according to the present application molds a circuit package 400 measuring a flow rate in a first resin molding process, resin molds a housing 302 with an entrance groove 351, a front-side sub passage groove 332, and an exit groove 353 in a second resin molding process, and surrounds the circuit package 400 obtained in the first resin molding process with a resin in the second resin molding process and fixes the circuit package to the housing 302.SELECTED DRAWING: Figure 1 |
