发明名称 LIQUID FILLING METHOD
摘要 A large number of pattern elements stands upright on an upper surface of a substrate. After the upper surface of the substrate has been processed using a processing liquid, liquid filling processing for filling the upper surface with a filler solution is performed, in which the filler solution having a viscosity of three centipoises or more is applied to a central part of the upper surface. Then, by rotating the substrate at 1000 revolutions per minute or less, the processing solution adhering to the entire upper surface is replaced by the filler solution, and a solution layer of a predetermined thickness is formed. In this way, making the viscosity of the filler solution relatively high and making the centrifugal force acting at the time of rotating the substrate relatively low suppresses deformation of the pattern elements at the time of filling with a filler that uses the filler solution.
申请公布号 US2016336169(A1) 申请公布日期 2016.11.17
申请号 US201615148369 申请日期 2016.05.06
申请人 SCREEN Holdings Co., Ltd. 发明人 FUJIWARA Naozumi;YAMAGUCHI Naoko
分类号 H01L21/02;B08B3/02;B08B7/00;B08B3/08 主分类号 H01L21/02
代理机构 代理人
主权项 1. A liquid filling method for filling a main surface of a substrate having a pattern formed thereon with a filler solution after said main surface has been processed using a processing liquid, the method comprising: a) applying a filler solution having a viscosity of three centipoises or more to a central part of a main surface of a substrate, said main surface having a large number of pattern elements that stand upright; and b) replacing a processing liquid that adheres to an entirety of said main surface with said filler solution and forming a solution layer of a predetermined thickness by rotating said substrate at V revolutions per minute or less, where V is a value obtained by multiplying a square root of (150/r) by 1000 and r is a radius of said substrate in millimeters.
地址 Kyoto JP