| 摘要 |
A manufacturing method for a component incorporated substrate according to the present invention includes positioning an electronic component (14) with reference to a mark (12) formed on a copper layer (4), the mark (12) consisting of a material less easily etched than copper by a copper etching agent used for etching of copper, after mounting the electronic component (14) on the copper layer (4) with an adhesive layer (18) interposed therebetween, embedding the electronic component (14) and the mark (12) in an insulating substrate (34), thereafter, etching and removing a part of the copper layer (4) to form a window (W1) for exposing the mark (12), forming an LVH (46) reaching a terminal (20) of the electronic component (14) with reference to the exposed mark (12), electrically connecting the terminal (20) and the copper layer (4) via a conduction via (47) formed by applying copper plating to the LVH (46), and, thereafter, forming the copper layer (4) into a wiring pattern (50). |
