| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent adhesion of an adhesive agent to a lead around an island of a lead frame as much as possible, concerning a die bonding method where an IC chip is mounted to the island by the adhesive agent after the adhesive agent is applied to the island of the lead frame by using a dispense nozzle. <P>SOLUTION: A step to apply an adhesive agent 30 is designed to apply the adhesive agent 30 by using a covering member 100 that is provided with an opening 110 corresponding to an island 21 and covers regions other than the island 21 in a lead frame 20. The edge of the opening 110 in the covering member 100 is provided with a scattering prevention wall (120) that can prevent the adhesive agent 30 from scattering to the regions of the lead frame 20 covered with the covering member 100. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
