发明名称 |
Package system with a shielded inverted internal stacking module and method of manufacture thereof |
摘要 |
A method of manufacture of a package system includes: providing a base package substrate having conductive elements; providing an internal stacking module having a semiconductor die mounted on a package substrate and a first encapsulant surrounding at least portions of the semiconductor die and the package substrate; covering at least portions of the first encapsulant in the internal stacking module with an electromagnetic interference shield, the electromagnetic interference shield shaped to have an outside face; mounting the internal stacking module over the base package substrate with the outside face of the electromagnetic interference shield facing the base package substrate; and encapsulating at least portions of the internal stacking module, the electromagnetic interference shield, and the base package substrate using a second encapsulant.
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申请公布号 |
US8334171(B2) |
申请公布日期 |
2012.12.18 |
申请号 |
US20090629877 |
申请日期 |
2009.12.02 |
申请人 |
PAGAILA REZA ARGENTY;CAMACHO ZIGMUND RAMIREZ;BATHAN HENRY DESCALZO;STATS CHIPPAC LTD. |
发明人 |
PAGAILA REZA ARGENTY;CAMACHO ZIGMUND RAMIREZ;BATHAN HENRY DESCALZO |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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