| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film for connecting IC chips which can prevent the short circuit between an IC chip circuit and a substrate circuit. SOLUTION: The adhesive film for connecting IC chips contains insulating particles and does not contain conductive particles. The insulating particles have a diameter which is smaller than the bump height of the IC chip to be connected and is dispersed in an insulating adhesive. COPYRIGHT: (C)2008,JPO&INPIT
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