Conformal EMI shielding with enhanced reliability

摘要

An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed on a plurality of encapsulated modules by attaching a molded package panel to a process carrier (10) using a double side adhesive tape (12) before singulating the individual modules without separating them from the double side adhesive tape. By forming a conductive layer (50) over a mold encapsulant (16) and on the sidewalls of grooves (40-47) that are cut through the mold encapsulant (16) and underlying circuit substrate (14), the conductive layer (50) may be electrically coupled to one or more conductive connection pads (61-66) by virtue of the placement of the conductive connection pads at the periphery or side of the circuit substrate (14).