发明名称 Method of forming a memory capacitor structure using a self-assembly pattern
摘要 A capacitor structure and method of forming thereof on a substrate is described. The capacitor structure includes a substrate having a plurality of capacitor electrodes formed within an insulative retaining material, and a collar layer structure in contact with the plurality of capacitor electrodes, wherein the collar layer structure interconnects the plurality of capacitor electrodes and exposes the underlying insulative retaining material through openings having an unguided, random self-assembly pattern. Furthermore, the insulative retaining material may be removed from the capacitor structure. The method includes using a self-assembly process to form the interconnecting collar layer structure.
申请公布号 US9385129(B2) 申请公布日期 2016.07.05
申请号 US201514720279 申请日期 2015.05.22
申请人 Tokyo Electron Limited 发明人 Kang Hoyoung
分类号 H01L21/00;H01L27/108;H01L21/311;H01L21/768;H01L21/31;H01L21/283;H01L23/532;H01L49/02;H01L23/522;H01L23/528 主分类号 H01L21/00
代理机构 Wood, Herron & Evans, LLP 代理人 Wood, Herron & Evans, LLP
主权项 1. A method of forming a capacitor structure, comprising: providing a substrate having a plurality of capacitor electrodes formed within an insulative retaining material, the substrate further including a collar layer in contact with the plurality of capacitor electrodes; preparing a self-assembled polymer layer on the collar layer, the self-assembled polymer layer having a first domain phase-separated from a second domain; selectively removing the first domain of the self-assembled polymer layer while retaining the second domain of the self-assembled polymer layer to form an unguided, random self-assembly pattern on the substrate; and transferring the unguided, random self-assembly pattern into and through the collar layer to create a collar layer structure interconnecting the plurality of capacitor electrodes that has openings there through exposing the underlying insulative retaining material.
地址 Tokyo JP