发明名称 |
Method for forming recess-free interconnect structure |
摘要 |
A method for forming an interconnect structure includes forming a dielectric material layer on a semiconductor substrate. An oxygen-rich layer is formed over the dielectric material layer. The dielectric material layer and the oxygen-rich layer are patterned to form a plurality of vias in the semiconductor substrate. A barrier layer is formed in the plurality of vias and on the dielectric material layer leaving a portion of the oxygen-rich layer exposed. A metal layer is formed on the bather layer and on the exposed portion of the oxygen-rich layer, wherein the metal layer fills the plurality of vias. The semiconductor substrate is annealed at a predetermined temperature range and at a predetermined pressure to transform the exposed portion of the oxygen-rich layer into a metal-oxide stop layer. |
申请公布号 |
US9385029(B2) |
申请公布日期 |
2016.07.05 |
申请号 |
US201414570920 |
申请日期 |
2014.12.15 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Peng Chao-Hsien;Lee Hsiang-Huan;Shue Shau-Lin |
分类号 |
H01L21/768;H01L23/532;H01L23/522 |
主分类号 |
H01L21/768 |
代理机构 |
Slater Matsil, LLP |
代理人 |
Slater Matsil, LLP |
主权项 |
1. A method, comprising:
forming a dielectric material layer on a semiconductor substrate; forming an oxygen-rich layer over the dielectric material layer; patterning the dielectric material layer and the oxygen-rich layer to form a plurality of vias in the semiconductor substrate; forming a barrier layer in the plurality of vias and on the dielectric material layer leaving a portion of the oxygen-rich layer exposed; forming a metal layer on the barrier layer and on the exposed portion of the oxygen-rich layer, wherein the metal layer fills the plurality of vias; and annealing the semiconductor substrate at a predetermined temperature range and at a predetermined pressure to transform the exposed portion of the oxygen-rich layer into a metal-oxide stop layer. |
地址 |
Hsin-Chu TW |