发明名称 |
SEMICONDUCTOR CHIP PACKAGE HAVING SHIELD BONDING WIRE FOR HIGH FREQUENCY AND HIGH DENSITY |
摘要 |
A semiconductor device package including a semiconductor chip formed with a plurality of bonding pads including at least two multiple-bonding pads to which identical signals are transmitted; a substrate provided with a chip-support and a plurality of conductors for electrically connecting the chip to external devices; a plurality of bonding wires for electrically connecting said bonding pads to the conductors including multiple-bonding wires for electrically connecting the multiple-bonding pads to corresponding conductors; and a current looper for screening magnetic fields generated from the bonding wires so that the magnetic fields cannot interfere each other, the current looper being located between the multiple-bonding wires and bonded to the substrate at both ends. |
申请公布号 |
KR0156334(B1) |
申请公布日期 |
1998.10.15 |
申请号 |
KR19950035522 |
申请日期 |
1995.10.14 |
申请人 |
SAMSUNG ELECTRONICS CO.,LTD |
发明人 |
LEE, HAE-YOUNG;LEE, KYUNG-SUN;HAN, CHAN-MIN |
分类号 |
H01L21/60;H01L21/607;H01L23/28;H01L23/49;H01L23/552;H01L23/66 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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