发明名称 |
Circuit board with conductor layer for increased breakdown voltage |
摘要 |
A circuit board includes an insulating substrate having opposed first and second surfaces and a thickness; and first and second conductive layers disposed on the first and second surfaces of the insulating substrate, respectively, wherein the first conductive layer has an end surface projecting outwardly from the first conductive layer in a direction generally parallel to the first surface of the insulating substrate, and a contact surface in contact with the insulating substrate and joining the end surface at a junction, wherein the end surface is spaced from the first surface of the insulating substrate except at the junction.
|
申请公布号 |
US5986218(A) |
申请公布日期 |
1999.11.16 |
申请号 |
US19960652291 |
申请日期 |
1996.07.10 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
MUTO, HIROTAKA;KIMURA, TOSHINORI;FUJII, HARUHISA;KATO, KAZUHARU |
分类号 |
H05K3/34;H01L21/48;H01L23/12;H01L23/538;H05K1/02;H05K1/03;H05K3/40;(IPC1-7):H01R9/09 |
主分类号 |
H05K3/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|