| 摘要 |
An LED illuminating device (100) comprises: a base (10), made of a metal radiating material; a mirror surface aluminum plate (50), laminated on and attached to the base (10) in a cold pressing manner, wherein at least one area of the surface of the mirror surface aluminum plate (50) is a die bonding area; multiple naked LED chips (40), directly bonded to a die bonding area of the mirror surface aluminum plate (50) by binder; a circuit board (30), mounted on the base (10), wherein the LED chips (40) and the circuit board (30) form electrical connections in a wire bonding manner; and a packaging gel (20), at least forming potting coverage to the die bonding area. Also disclosed is an LED illuminating lamp (200) using the LED illuminating device (100). According to the LED illuminating device (100) and the LED lamp (200), the transmission path of heat emitted from an LED is greatly reduced compared with that of a surface-mount packaging structure and that of a COB packaging structure, the radiating effect is good, and the reliability and the service life of the LED are greatly improved. |
