发明名称 |
PHOTODIODE GATE DIELECTRIC PROTECTION LAYER |
摘要 |
The present disclosure relates to a method the present disclosure relates to an integrated chip having an active pixel sensor with a gate dielectric protection layer that reduces damage to an underlying gate dielectric layer during fabrication, and an associated method of formation. In some embodiments, the integrated chip has a photodetector disposed within a substrate, and a gate structure located over the substrate. A gate dielectric protection layer is disposed over the substrate and extends from along a sidewall of the gate structure to a location overlying the photodetector. The gate dielectric protection layer has an upper surface that is vertically below an upper surface of the gate structure. |
申请公布号 |
US2016276384(A1) |
申请公布日期 |
2016.09.22 |
申请号 |
US201615169994 |
申请日期 |
2016.06.01 |
申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
发明人 |
Chou Cheng-Hsien;Hsu Wen-I;Tsao Tsun-Kai;Lai Chih-Yu;Lu Jiech-Fun;Tu Yeur-Luen |
分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
1. An integrated chip, comprising:
a photodetector disposed within a substrate; a gate structure located over the substrate; and a gate dielectric protection layer disposed over the substrate and extending from along a sidewall of the gate structure to a location overlying the photodetector, wherein the gate dielectric protection layer has an upper surface that is vertically below an upper surface of the gate structure. |
地址 |
Hsin-Chu TW |