发明名称 LIGHT-EMITTING DEVICE
摘要 A light-emitting device according to an embodiment includes a light-emitting part and an external wiring. The light-emitting part includes: a pair of insulating substrates that has light transmissive property and flexibility; a plurality of light-emitting elements arranged between the pair of insulating substrates; an internal wiring pattern that is provided between the pair of insulating substrates, and is connected to the light-emitting elements; and a resin layer that has light transmissive property and insulating property, and is provided between the pair of insulating substrates. An end of the external wiring is divided into a plurality of wirings having a line width that is narrower than a line width of the internal wiring pattern. An end of the internal wiring pattern is bonded, at an end of the insulating substrates, to the end of the external wiring that is divided into a plurality of wirings by an anisotropic conductive adhesive.
申请公布号 US2016276321(A1) 申请公布日期 2016.09.22
申请号 US201615077143 申请日期 2016.03.22
申请人 TOSHIBA HOKUTO ELECTRONICS CORPORATION 发明人 MAKI Keiichi
分类号 H01L25/075;H01L33/56;H01L33/42;H05K3/32;H01L23/498;H01L33/48;H05K1/18;H01L33/62;H01L23/00 主分类号 H01L25/075
代理机构 代理人
主权项 1. A light-emitting device having flexibility comprising: a light-emitting part; and an external wiring connected to the light-emitting part, wherein the light-emitting part comprises:a pair of insulating substrates that has light transmissive property and flexibility;a plurality of light-emitting elements arranged between the pair of insulating substrates;an internal wiring pattern that is formed on an inside surface of at least one of the pair of insulating substrates, and is connected to the light-emitting elements; anda resin layer that has light transmissive property and insulating property, and is provided between the pair of insulating substrates, wherein an end of the external wiring is divided intoa plurality of wirings having a line width that is narrower than a line width of the internal wiring pattern, and wherein an end of the internal wiring pattern is bonded, at an end of the insulating substrates, to the end of the external wiring that is divided into a plurality of wirings by an anisotropic conductive adhesive.
地址 Asahikawa-Shi JP