| 发明名称 |
WINDOW CLAMP |
| 摘要 |
A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit (“IC”) component stacks mounted on the leadframe strip. |
| 申请公布号 |
US2016276305(A1) |
申请公布日期 |
2016.09.22 |
| 申请号 |
US201514663978 |
申请日期 |
2015.03.20 |
| 申请人 |
Texas Instruments Incorporated |
发明人 |
Merto Ruby Ann Maya;Cayabyab Jerry Gomez;Balagtas Edsel Gomez |
| 分类号 |
H01L23/00;H01L21/67;H01L21/687;B23K1/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wire bonding machine window clamp assembly comprising:
a support plate adapted to support a leadframe strip; and a frame structure defining a central clamp opening adapted to expose a portion of said leadframe strip, said frame structure comprising at least one elongate frame member having a first surface portion adapted to engage a top surface of said leadframe strip and an second surface portion adapted to engage upper surfaces of integrated circuit (“IC”) component stacks mounted on said leadframe strip. |
| 地址 |
Dallas TX US |
