VERTICAL SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

The present invention discloses a vertical semiconductor device and a manufacturing method thereof. The vertical semiconductor device includes: a substrate having a first surface and a second surface, the substrate including a conductive array formed by multiple conductive plugs through the substrate; a semiconductor layer formed on the first surface, the semiconductor layer having a third surface and a fourth surface, wherein the fourth surface faces the first surface; a first electrode formed on the third surface; and a second electrode formed on the second surface for electrically connecting to the conductive array.

主权项

1. A vertical semiconductor device, comprising:
a substrate made of a non-conductive material and having a first surface and a second surface facing opposite directions; a conductive array formed by a plurality of conductive plugs which extend from the first surface completely through the substrate to the second surface; a semiconductor layer formed on and in contact with the first surface, the semiconductor layer having a third surface and a fourth surface facing opposite directions, wherein the fourth surface faces the first surface; a first electrode formed on and in contact with the third surface; and a second electrode formed on and in contact with the second surface, for electrically connecting to the conductive array.