发明名称 Thermal Imaging Device
摘要 A thermal imaging device comprises a focal plane array disposed on a focal plane substrate. The focal plane array comprises a plurality of pixels grouped into sub-arrays of pixels. The device also comprises a lens array comprising a plurality of lenslets. Each of the lenslets is arranged to focus infrared rays on a respective one of the sub-arrays of pixels. The focal plane array is enclosed in a vacuum in a space between the lens array and the focal plane substrate, and a readout circuit is electrically connected to the pixels. The thermal imaging device has a small form factor and low cost while maintaining adequate performance, enabling expanded usage of thermal imaging (e.g., in security, surveillance, first responder, defense and/or automotive applications).
申请公布号 US2016380014(A1) 申请公布日期 2016.12.29
申请号 US201414210276 申请日期 2014.03.13
申请人 INVIS TECHNOLOGIES CORPORATION 发明人 Ganapathi Srinivasan K.;Stephanou Philip J.;Petersen Kurt E.
分类号 H01L27/146;G02B13/00;G02B3/00;H04N5/33;H04N5/378 主分类号 H01L27/146
代理机构 代理人
主权项 1. A thermal imaging device comprising: a) a focal plane array disposed on a focal plane substrate, wherein the focal plane array comprises a plurality of pixels grouped into sub-arrays of pixels; b) a lid substrate arranged with the focal plane substrate to enclose the focal plane array in a vacuum; c) a lens array comprising a plurality of lenslets, wherein each of the lenslets is arranged to focus infrared rays on a respective one of the sub-arrays of pixels; d) support structures arranged between the lid substrate and the focal plane substrate to support a portion of the lid substrate through which the infrared rays are transmitted; and e) a readout circuit electrically connected to the pixels.
地址 Santa Clara CA US
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