发明名称 |
Thermal Imaging Device |
摘要 |
A thermal imaging device comprises a focal plane array disposed on a focal plane substrate. The focal plane array comprises a plurality of pixels grouped into sub-arrays of pixels. The device also comprises a lens array comprising a plurality of lenslets. Each of the lenslets is arranged to focus infrared rays on a respective one of the sub-arrays of pixels. The focal plane array is enclosed in a vacuum in a space between the lens array and the focal plane substrate, and a readout circuit is electrically connected to the pixels. The thermal imaging device has a small form factor and low cost while maintaining adequate performance, enabling expanded usage of thermal imaging (e.g., in security, surveillance, first responder, defense and/or automotive applications). |
申请公布号 |
US2016380014(A1) |
申请公布日期 |
2016.12.29 |
申请号 |
US201414210276 |
申请日期 |
2014.03.13 |
申请人 |
INVIS TECHNOLOGIES CORPORATION |
发明人 |
Ganapathi Srinivasan K.;Stephanou Philip J.;Petersen Kurt E. |
分类号 |
H01L27/146;G02B13/00;G02B3/00;H04N5/33;H04N5/378 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
1. A thermal imaging device comprising:
a) a focal plane array disposed on a focal plane substrate, wherein the focal plane array comprises a plurality of pixels grouped into sub-arrays of pixels; b) a lid substrate arranged with the focal plane substrate to enclose the focal plane array in a vacuum; c) a lens array comprising a plurality of lenslets, wherein each of the lenslets is arranged to focus infrared rays on a respective one of the sub-arrays of pixels; d) support structures arranged between the lid substrate and the focal plane substrate to support a portion of the lid substrate through which the infrared rays are transmitted; and e) a readout circuit electrically connected to the pixels. |
地址 |
Santa Clara CA US |